

High thermal conductivity for efficient heat transfer
Suitable for CPUs, GPUs, and other IC components
Non-corrosive and electrically non-conductive
Easy to apply with syringe-style dispenser
Stable performance over long periods
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(edit with the Customer Reassurance module)
(edit with the Customer Reassurance module)
Thermal Conductivity: Typically rated at around 1.93 W/m·K, HY510 is designed to effectively transfer heat between components and their heat sinks or coolers.
Application Areas: Ideal for use with processors (CPUs), graphics cards (GPUs), power transistors, and chipset modules in desktops, laptops, and other electronic devices.
Non-Conductive Formula: Electrically non-conductive to reduce the risk of short circuits if the paste spreads beyond the chip area during application.
Safe and Stable: Formulated to resist drying out, bleeding, or cracking over time, ensuring consistent performance during extended use.
Easy Dispensing: Packaged in a syringe for precise and clean application, reducing waste and ensuring even coverage on component surfaces.
Compatibility: Works with both air and liquid cooling systems, making it suitable for a wide range of setups from basic office machines to high-performance rigs.
Operating Range: Effective in a wide temperature range, typically from -30°C to +280°C, providing reliability in various environmental conditions.
Storage and Lifespan: Long shelf life when stored properly in a cool, dry place; retains consistency and performance even after prolonged storage.
Cost-Effective Solution: Provides good thermal performance at a budget-friendly price, suitable for routine maintenance and system builds.
General Usage Note: A thin, even layer is sufficient—excess application does not improve performance and may hinder proper heat sink contact.