

High-efficiency thermal interface compound
Ideal for CPUs, GPUs, and heat-sensitive chips
Electrically non-conductive and non-corrosive
Syringe applicator for easy, clean use
Stable under high temperatures and long-term use
(edit with the Customer Reassurance module)
(edit with the Customer Reassurance module)
(edit with the Customer Reassurance module)
Thermal Conductivity: Generally rated around 1.8–2.0 W/m·K, HM501 provides effective thermal transfer between chips and heat sinks or coolers, improving system cooling performance.
Use Case: Designed for various electronics including computer processors, graphics cards, chipsets, power ICs, and other high-temperature components.
Non-Conductive Formula: Safe for use on sensitive electronics—does not conduct electricity, reducing risk of short circuits even with slight overspread.
Long-Term Stability: Remains viscous and effective over time without drying, cracking, or flowing out, ensuring consistent thermal performance.
User-Friendly Application: Supplied in a syringe-style tube that allows precise dispensing and minimal mess, ensuring a clean and even spread.
Wide Compatibility: Suitable for use with air coolers and liquid cooling blocks; compatible with aluminum and copper heat sinks.
Thermal Resistance: Offers low thermal resistance to improve heat dissipation, helping maintain lower temperatures under load.
Temperature Range: Operates effectively in extreme conditions, typically between -30°C and +280°C, making it reliable across various system types.
Maintenance-Friendly: Easy to remove and reapply during maintenance or component upgrades, using standard thermal paste cleaning methods.
Cost & Value: Offers good performance at an affordable price, making it a practical choice for both DIY builders and technicians handling multiple systems.